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1ch high side switch ics 1.5 a current limit high side switch ics bd20 61afj bd2065afj general description BD2061AFJ and bd2065afj are s ingle channel high side switch ic s with over - current protection for u niversal s erial b us (usb) power supply line. these ics have low on - resistance n- channel power mosfets with low supply current , built - in over - current protection circuit, thermal shutdown circuit , under voltage lockout and soft - start circuit. features ? built -in l ow on -r esistance nch mosfet ( typ=80m ) ? control input logic ? active -low : BD2061AFJ ? active - high : bd2065afj ? soft - start circuit ? over - current protection ? thermal s hutdown ? under v oltage l ockout function ? open d rain error f lag o utput ? reverse -current p rotection when switch off ? flag output delay app lications usb h ub in consumer a ppliances, pc, pc p eripheral e quipment, and so forth key specifications ? i nput v oltage r ange: 2.7v to 5.5v ? on -r esistance: 8 0m (typ) ? continu ous current l oad: 1.0a ? over - current t hreshold: 1.1a (min), 2.3a (max) ? s tandby current: 0.01 a ( typ ) ? output r ise t ime: 1.2ms(typ) ? operating temperature range : - 40 c to +85 c package w(typ) d(typ) h (max) typical application circuit lineup over - current t hreshold control input logic package orderable part number min typ max 1.1a 1.5 a 2.3a low sop -j8 reel of 2 5 00 BD2061AFJ -e2 1.1a 1.5 a 2.3a high sop -j8 reel of 2 5 00 bd2065afj -e2 out out out in in /oc gnd vbus d - d+ gnd 5v(typ) c l c in - + en( /en ) sop - j8 4.90mm x 6.00mm x 1.65mm product structure silicon monolithic integrated circuit this product has not designed protection against radioactive rays 1/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003 datashee t
BD2061AFJ bd2065afj data s heet block d iagram in in / oc en(/en) out out out gnd charge pump gate logic tsd ocd uvlo pin configurations pin description pin no. symbol i / o pin f unction 1 gnd i ground . 2, 3 in i power supply input. input terminal to the power switch and power supply input terminal of the internal circuit. when used, connect each pin outside. 4 en, /en i enable input. /en: power switch on at l ow level. ( BD2061AFJ) en: power switch on at h igh level. ( bd2065afj) high level input > 2.0v, l ow level input < 0.8v. 5 /oc o error flag output . low at over current, thermal shutdown . open drain output. 6, 7, 8 out o power switch output. when used, connect each pin outside. BD2061AFJ top view 1 2 3 4 8 7 6 5 gnd in in /oc out out out /en bd2065afj top view 1 2 3 4 8 7 6 5 gnd in in /oc out out out en 2/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet absolute maximum ratings parameter symbol rating unit supply v oltage v in - 0.3 to + 6.0 v enable v oltage v en , v /en - 0.3 to + 6.0 v /oc v oltage v /oc - 0.3 to + 6.0 v /oc current i /oc 10 ma out v oltage v out - 0.3 to + 6.0 v storage t emperature t stg - 55 to + 150 c power d issipation pd 0.67 (note 1 ) w (note 1) derating in done 5.4 mw/c for operating above ta R 25c (mount on 1 - layer 70.0mm x 70.0mm x 1.6mm board) caution: ope rating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max operating v oltage v in 2.7 - 5.5 v operating t emperature t opr -40 - + 85 c continuous o utput curr ent i lo 0 - 1.0 a electrical c haracteristics BD2061AFJ (u nless otherwise specified , v in = 5.0v, ta = 25 c) parameter symbol limit unit condition s min typ max operating c urrent i dd - 90 120 a v /en = 0v, out = open standby c urrent i stb - 0.01 1 a v /en = 5v, out = open /en i nput v oltage v /enh 2.0 - - v high i nput v /enl - - 0.8 v low i nput - - 0.4 v low input 2.7v v in 4.5v /en i nput c urrent i /en - 1.0 + 0.01 + 1.0 a v /en = 0v or v /en = 5v /oc o utput low v oltage v /oc - - 0.5 v i /oc = 5ma /oc o utput l eak c urrent i l/oc - 0.01 1 a v /oc = 5v /oc d elay t ime t /oc - 2.5 8 ms on - r esistance r on - 80 100 m i out = 1.0a over - current threshold i th 1.1 1.5 2.3 a output c urrent at short i sc 1.1 1.5 1.9 a v in = 5v, v out = 0v, c l = 100 f (rms) output r ise t ime t on1 - 1.2 10 ms r l = 10 , c l = open output t urn on t ime t on2 - 1.5 20 ms output f all t ime t off1 - 1 20 s output t urn off t ime t off2 - 3 40 s uvlo t hreshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in 3/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet ele ctrical c haracteristics - c ontinued bd2065afj (u nless otherwise specified , v in = 5.0v, ta = 25 c) parameter symbol limit unit condition s min typ max operating current i dd - 90 120 a v en = 5v, out = open standby c urrent i stb - 0.01 1 a v en = 0v, o ut = open en i nput v oltage v enh 2.0 - - v high i nput v enl - - 0.8 v low i nput - - 0.4 v low input 2.7v v in 4.5v en i nput c urrent i en - 1.0 +0.01 + 1.0 a v en = 0v or v en = 5v /oc o utput low v oltage v /oc - - 0.5 v i /oc = 5ma /oc o utput l eak c urrent i l/oc - 0.01 1 a v /oc = 5v /oc d elay t ime t /oc - 2.5 8 ms on -r esistance r on - 80 100 m i out = 1.0a over - current threshold i th 1.1 1.5 2.3 a output c urrent at short i sc 1.1 1.5 1.9 a v in = 5v, v out = 0v, c l = 100 f (rms) output r ise t ime t on1 - 1. 2 10 ms r l = 10 , c l = open output t urn on t ime t on2 - 1.5 20 ms output f all t ime t off1 - 1 20 s output t urn off t ime t off2 - 3 40 s uvlo threshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in 4/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet measurement circuit en(/en) out /oc in gnd v in in out out 1uf a v en (v /en ) en(/en) out /oc in gnd v in r l c l in out out 1uf v en (v /en ) a. operating current b. en , / en input voltage, o utput rise / fall time en(/en) out /oc in gnd v in c l in out out 1uf i out v in 10k v en (v /en ) en(/en) out /oc in gnd v in in out out 1uf i /o c v in v en (v /en ) c. on - resistance, o ver current detection d. /oc o utput low v oltage figure 1. measurement circuit timing diagram t on1 v out 10% 90% 90% t off1 t on2 v /en v /enl t off2 v /enh 10% t on1 v out 10% 90% 90% t off1 t on2 v en v enh t off2 v enl 10% figure 2. timing diagram (BD2061AFJ) figure 3. timing diagram (bd2065afj) 5/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical performance curves figure 7. standby c urrent vs ambient temperature (en, /en disable) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb [a] v in =5.0v standby current: i stb [ a ] ambient temperature : ta [ c] 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] ta=25 c figur e 6. standby c urrent vs supply voltage (en, /en disable) standby current: i stb [ a ] supply voltage : v in [ v ] 0 20 40 60 80 100 120 - 50 0 50 100 operating current: i dd [ a ] ambient temperature : ta [ c] v in =5.0v figure 5. operating current vs ambient temperature (en, /en enable) figure 4. operating current vs supply voltage (en, /en enable) 0 20 40 60 80 100 120 2 3 4 5 6 supply voltage : v in [v] ta=25 c supply voltage : v in [ v ] operating current: i dd [ a ] 6/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical performance curves - continued 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en , v /en [v] 0 low to high high to l ow ta=25 c figure 8. en, /en i nput v oltage vs supply voltage 0.0 0.1 0.2 0.3 0.4 0.5 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage : v /o c [v] ta=25 c figure 10. /oc o utput low v oltage vs supply voltage 0.0 0.1 0.2 0.3 0.4 0.5 -50 0 50 100 ambient temperature : ta[ ] /oc output low voltage : v /o c [v] v in =5.0v figure 11. /oc o utput low v oltage vs ambient temperature enable input voltage : v en , v /en [ v ] /oc output low voltage : v /oc [ v ] /oc output low voltage : v /oc [ v ] ambient temperature : ta [ c] supply voltage : v in [ v ] supply voltage : v in [ v ] figure 9. en, /en input voltage vs ambient temperature enable inpu t voltage : v en, v/ en [ v ] ambient temperature : ta[c] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 v in =5.0v high to low low to high 7/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical performance curves - continued figure 1 5. /oc d elay t ime vs ambient temperature v in =5.0v 0.0 - 50 0 5 0 100 ambient temperature: ta [ ] 1.0 2.0 3.0 4.0 5.0 /oc delay time : td /oc [ ms ] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage: v in [v] /oc delay time : ta=25 c td /oc [ ms ] figure 1 4. /oc d elay t ime vs supply voltage figure 1 3. on - r esistance vs ambient tempe rature 0 50 100 150 200 -50 0 50 100 v in =5.0v figure 1 2. on - r esistance vs supply voltage 0 50 100 150 200 2 3 4 5 6 supply voltage : v dd [v] on resistance : r on[ m] ta=25 c on - resistance : r on [ m ] on - resistance : r on [ m ] /oc delay time : t /oc [ m s ] /oc delay time : t /oc [ms] ambient temp erature : ta [ c] ambient temperature : ta [ c] supply voltage : v in [ v ] supply voltage : v in [ v ] 8/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical performance curves - continued 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 ta=25 c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] rise time : t on1 [ms] v in =5.0v figure 19. output r ise t ime vs ambient temperature figure 18. output r i se t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 v in =5.0v figure 17. short circuit current vs ambient temperature short circuit current : i sc [ a ] short circuit current : i sc [ a ] output rise time : t on1 [ ms ] output rise time : t on1 [ ms ] ambient temperature : ta [ c] ambient temperature : ta [ c] supply voltage : v in [ v ] supply voltage : v in [ v ] figure 1 6. short circuit current vs supply voltage 9/ 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [s] v in =5.0v figure 2 3. output f all t ime vs ambient temperature output turn on time : t on2 [ ms ] output turn on time : t on2 [ ms ] output fall time : t off1 [ s ] output fall time : t off1 [ s ] ambient temperature : ta [ c] ambient temperature : ta [ c] supply voltage : v in [ v ] supply voltag e : v in [ v ] figure 2 0. output t urn on t ime vs supply voltage figure 2 1. output t urn on t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 v in =5.0v figure 2 2. output f all t ime vs supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 ta=25 c 10/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical performance curves - continued figure 27. uvlo hysteresis voltage vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] turn off time : t off2 [s] ta=25 c output turn off time : t off2 [ s ] supply voltage ; v in [v] figure 2 5. output turn off time vs ambient temperature figu re 2 4. output turn off time vs supply voltage 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] uvlo hysteresis voltage : vhys[v uvlo hysteresis voltage : v hys [ v ] ambient temperature ; ta[c] 2.0 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold voltage : v u vl oh , v u vl ol [v] v uvloh v uvlol uvlo threshold : v uvloh, v uvlol [v] ambient temperature ; ta [c] figure 2 6. uvlo threshold voltage vs ambient tempe r ature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [s] v in =5.0v output turn off time : t off2 [ s ] ambient temperature ; ta[c] 11 / 22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical wave forms time ( 20ms/div.) figure 3 1. over current r esponse r amp ed l oad (BD2061AFJ) v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) v in =5v time ( 0.5ms/div.) figure 3 0. inrush current r esponse (BD2061AFJ) v /en (5v/div.) i out (0.5a/div.) c l =47 f c l =220 f c l =147 f v in =5v r l = 5 v / oc (5v/div.) c l =330 f time(1ms/div.) figure 28. output rise characteristic (BD2061AFJ) v /en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v r l =10 c l =100 f time(1ms/div.) figure 29. output fall characteristic (BD2061AFJ) v /en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v r l =10 c l =100 f 12/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical wave forms - continued time ( 2ms/div.) figure 3 2. over current r esponse r amp ed l oad (BD2061AFJ) v in =5v v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) time ( 2ms/div.) figure 3 3. over current r esponse enable to shortcircuit (BD2061AFJ) v in =5v c l =100 f v /en (5v/div.) v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) time ( 2ms /div.) figure 3 4. over current r esponse output 1 short at enable (BD2061AFJ) v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) time ( 0.2s/div.) figure 3 5. over current r esponse output 1 short at enable (BD2061AFJ) thermal shutdown v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) 13/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical wave forms - continued regarding the output rise/fall and over current detection characteristics of bd2 065afj , refer to the characteristic of BD2061AFJ. time ( 10ms/div.) figure 37. uvlo r esponse decreasing v in (BD2061AFJ) v in (5v/div.) v out (5v/div.) v /oc (5v/div.) i out (1.0a/div.) r l =5 time ( 10ms/div.) figure 3 6. uvlo r esponse increasing v in (BD2061AFJ) r l =5 v in (5v/div.) v out (5v/div.) i out (1.0a/div.) v /oc (5v/div.) 14/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet typical a pplication c ircuit in out regulator out out out in in /oc gnd vbus d - d+ gnd usb controller vbus d - d+ gnd 5v( t yp ) 10k to 100k c l c in - + en( /en ) application information when excessive current flows due to output short circuit or so, ringing occurs by inductance of power source line and ic. this may cause bad effects on ic operations. in order to avoid this case, a bypass capacitor should be connected across the in terminal and gnd terminal of ic. a 1f or higher value is recommended. pull- up /oc output by resistance 10k to 100k. set- up value s for c l which satisfies the application. this application circuit does no t guarantee its operati on . when using the circuit with changes to the external circuit co nstant s, it is better to have an adequate margin for the external components such as static and transient characteristics as well as dispersion of the ic . functional description 1. switch o peration in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on by en(/en ) control input, both the in and out terminals are connected by a 80m bidirectional switch. therefore, current flows from out terminal to in terminal since the flow of current is from higher to lower potentials. on the other hand, when the switch is turned off, it is possible to prevent current from flowing reversely from out to in since a parasitic diode between the drain and the source of switch mosfet is not present. 2. thermal shutdown circuit ( tsd) if over - current would continue, the temperature of the ic would increase drastically. if the junction temperature goes b eyond 140 c ( t yp) during the condition of over - current detection, thermal shutdown circuit operates and turns the power switch off, causing the ic to output an error flag (/oc). then, when the junction temperature d rop s lower than 120 c (t yp), the power switch is turned on and error flag (/oc) is cancelled. this operation repeats u nless the cause of the increase of chips temperature is removed or the output of power switch is turned of f. the thermal shutdown circuit operates when the switch is on ( en(/en ) signal is active). 15/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet 3. over - current detection ( ocd) the over - current detection circuit limits current (i sc ) and outputs error flag ( /oc ) when current flowing in each switch mosfet exceeds a specified value. the over - current detection circuit works wh en the switch is on ( en(/en) signal is active). there are three types of response against over -current: (1) when the switch is turned on while the output is in short circuit status, the switch goes into current limit status immediately. (2) when the output short circuits or high - current load is connected while the switch is on, very large current flows until the over - current limit circuit reacts. when it exceeds the detection value, current limitation is carried out. (3) when the output current increases gradually, current limit circuit would not operate unless the output current exceeds the over - current detection value. but when the output current increases gradually and it exceeds the detection value, current limitation is carried out. 4. under voltage lockout (uvlo) u vlo circuit prevents the switch from turning on until v in exceeds 2.3v (typ). if v in drops below 2.2v(typ) while the switch is on, then uvlo shuts off the power switch. uvlo has hysteresis of a 100mv(typ) . under voltage lockout circuit works when the switch is on ( en(/en) signal is active). 5. error f lag (/oc) o utput error flag output is n- mos open drain output. during detection of over - current and/or thermal shutdown, the output level is low. o ver - current detection has delay filter . this delay filter preven ts current detection flags from being sent during instantaneous events such as in rush current at switch on or during hot plug. if fault flag output is unused, /oc pin should be connected to open or ground line. v /en v out i out v /oc output s hort c ircuit thermal s hutdown /oc d elay time figure 38. o ve r current detection, thermal shutdown timing (bd20 61 fj) v en v out i out v /oc output short c ircuit thermal shutdown /oc d elay time figure 39. o ver current detection, thermal shutdown timing (bd20 65 afj) 16/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet power d issipation (sop- j8) figure 4 0. power d issipation c urve (pd- ta curv e) i/o equivalen ce circuit symbol pin no e quivalen ce circuit en(/en) 4 /oc 5 out 6,7,8 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 a mbient tempera ture : ta [ ] power dissipation : pd [mw] power dissipation : p d [ mw ] ambient temperature : ta [ c ] 70mm x 70mm x 1.6mm glass epoxy board 17/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet operational notes 1. reverse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pins . 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transien t condition. 4. g round w iring pattern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in t he small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsiderat ion should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter . 7. in r ush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground w iring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter- pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 18/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet operational notes - continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in m utual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. f ig ure 41. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. the rmal s hutdown circuit(tsd) this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the juncti on temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. 15. thermal design perform thermal design in which there are adequate margins by taking into account the p ower dissipation (pd) in actual states of use. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c b e transistor (npn) resistor n region close-by parasitic elements 19/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet ordering information b d 2 0 6 1 a f j - e 2 part n umber package fj: sop -j8 packaging and forming specification e2: emboss ed tape and reel b d 2 0 6 5 a f j - e 2 part n umber package fj: sop -j8 packaging and forming specification e2: embossed tape and reel marking diagram part number part number marking bd2061a fj d061a bd2065afj d065a sop - j8 ( top view) part number marking lot number 1pin mark 20/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet physical dimension , tape and reel information package name sop - j8 21/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
BD2061AFJ bd2065afj data s heet revision history date revision changes 11 . mar .201 3 001 new release 25.jun.2013 002 changed character color from red to block of figure 41. modified block diagram and marking diagram . 21 . aug .2014 003 applied the rohm standard style and improved understandability . 22/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201 - 0e3e0h300150 -1-2 21.aug.2014 rev.003
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD2061AFJ package sop-j8 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD2061AFJ - web page distribution inventory

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